The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by ...

TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that.

Kyocera AVX has introduced three compact and high-performance internal, on-board, multiprotocol, 2.4-GHz antennas targeting high-demand system-in-package (SiP) applications. These include 5G mobile, ...

The MM912F634 system-in-package for automotive window lift applications is AEC Q100-qualified and has a 16-bit MCU (S12) with 32-Kbyte flash and 2-Kbyte RAM. The device features internal RC oscillator ...

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...

The "System in Package (SiP) Technology market" report analyzes important operational and performance data so one may compare them to their own business, the businesses of their clients, or the ...

Raytheon has just announced a new $20 million contract through its Strategic and Spectrum Missions Advanced Resilient Trusted Systems (SSMARTS) consortium to develop a next-gen, multi-chip package ...